The HSP192-DACxx-Pxxm SFP+ passive cable assembly is a low cost alternative for short reach applications. The design allows for a serial data transmission up to 12Gbps in each direction. The passive design has no signal amplification in the cable assembly. Electronic Dispersion Compensation (EDC) is typically used on host board designs when passive copper cable assemblies are utilized. EDC allows for an extended length of passive cable assemblies. EEPROM signature enables the host to differentiate between a passive copper cable assembly and a fiber optic module. The mechanical design of the braid crimp and EMI skirt ensure that EMI radiation is sufficiently suppressed. Additionally, the copper cable acts as a natural heat sink. The low power consumption assists in making the passive copper cable assembly an economic solution for within rack or rack to rack applications.